Solderless Breadboard with 270 tie points total: 230 tie-point prototyping area, plus two 20 tie-point strips suitable for ground and positive power Accepts wires 21 to 26 AWG, or pins of 0.4 to 0.7mm diameter White ABS plastic body with 4 mounting holes. Embossed legend indicates columns and rows with numbers and letters. Peelable adhesive tape backing for attaching to a surface. Metal back plate provided. Size: 3.3" × 1.8" × 0.3". Weight: 1.07 ounce. This small solderless breadboard is ideal for testing, prototyping, and experimentation. It features 270 tie points total: 230 tie-point prototyping area, plus two 20 tie-point strips suitable for ground and positive power. Embossed legend indicates columns and rows with numbers and letters. The tie points accept wires 21 to 26 AWG, or pins of 0.4 to 0.7mm diameter. ABS plastic construction with 4 mounting holes. Comes with a peelable adhesive tape backing for attaching the board to a surface, and a metal back plate is also included. Measures 3.3" × 1.8" × 0.3" and weighs 1.07 ounce.
