2position single-row unshrouded male header connector.The primary electrical function of this component is to act as a board-to-board mezzanine stacking link or a wire-to-board signal routing post soldered directly into a printed circuit board (PCB).The structural backbone belongs to the universally adopted AMPMODU System 50 or standard AMPMODU Interconnect family, featuring a standard 2.54 mm (0.100 inch) pin pitch spacing.The physical housing is molded from a high-temperature, glass-filled thermoplastic capable of safely withstanding the extreme heat curves of wave or reflow soldering processes.The 2 square post contacts are manufactured from a high-conductivity copper alloy or phosphor bronze, featuring a high-reliability selective gold plating on the primary mating interface, transitioning to tin plating over the solder tails.The pins are arranged in a strict vertical orientation, utilizing standard straight through-hole PCB pins to establish a vibration-resistant, low-profile connection point on the board.Industry Equivalents (Cross-References)The TE Connectivity 87226-2 is the active direct factory replacement code designation, representing the identical component layout manufactured under current global catalog guidelines.The Molex 0022284023 serves as a direct third-party industry alternative, providing an identical 2-position, 0.100-inch pitch unshrouded vertical header that matches the PCB pin layout.The Samtec TSW-102-07-G-S functions as a high-reliability precision alternative, mirroring the single-row through-hole geometry and gold-plated contact zones.The FCI / Amphenol 68000-402HLF is a secondary commercial-grade drop-in substitute choice, aligning perfectly with the physical row thickness and grid boundaries of the original AMP link.
