Quick Specs Type: Interconnect bay filler blank Enclosure Compatibility: HPE BladeSystem C3000 and C7000 Purpose: Maintains airflow and thermal balance Installation: Tool-less, snap-in design Use Case: Blocks empty interconnect bays when no module is present Material: Durable plastic construction Part Number: 414053-001 The HPE C3000 & C7000 Interconnect Filler Module is a precision-designed blank used to fill empty interconnect bays in BladeSystem enclosures. It helps maintain proper airflow and cooling efficiency by blocking open slots where interconnect modules, such as switches or pass-throughs, are not installed. This passive component is critical in preserving thermal balance inside the chassis. Ideal for both C3000 and C7000 enclosures, this interconnect filler is easy to install and remove without tools. It ensures that airflow is directed over active components instead of escaping through unused bays, which helps prevent overheating and improves system reliability. Use of filler blanks is an HPE-recommended best practice in any partially populated blade enclosure.
