TO-220 HEATSINK Board-level low-profile extruded U-type cooling heatsink conforming to EIA JEDEC semiconductor physical installation standards, designed specifically to isolate and dissipate thermal loads from standard TO-220 transistor package profiles, features a compact baseline geometry with a 0.750-inch (19.05mm) height off the printed circuit board, 0.520-inch (13.21mm) layout width, and a 0.500-inch (12.70mm) profile length, 7.0°C/W nominal thermal resistance rating threshold under natural convection, fabricated from a high-conductivity extruded aluminum base structure finished with a uniform black anodized layer for enhanced radiative heat dissipation, engineered with an integrated bolt-on physical attachment method featuring a single centered mounting hole to ensure maximum contact pressure and lower interfacial thermal impedance across compact power supplies, motor drives, and signal amplifier modules. Unit Sourcing Compatibility: This component came out of linear regulator sub-assemblies, low-power switching power supplies, control decks, and multi-channel audio power amplifier cards managed under CAGE Code 65940. Exact Industry Equals: Wakefield-Vette 274-2AB and Wakefield Thermal 274-2AB.
