Ai-Thinker PB-03F is a compact BLE 5.2 module based on the PHY6252 low-power Bluetooth SoC, designed for IoT, smart home, portable electronics, and wearable applications. As part of the official Ai-Thinker PB series, the PB-03F supports SIG Mesh, low-power Bluetooth communication, and practical embedded integration for connected products that need compact size, flexible interfaces, and stable wireless performance. The Ai-Thinker PB-03F BLE module is especially suitable for developers building smart lighting, smart sockets, smart air conditioners, battery-powered devices, and low-power BLE Mesh systems. With support for secondary development, AT commands, FOTA, and package compatibility with the 12F series, the PB-03F offers a flexible option for embedded Bluetooth product design. Features BLE 5.2 module based on the PHY6252 low-power Bluetooth SoC Supports SIG Mesh and low-power BLE communication for IoT and smart home products Supports Bluetooth data rates of 125Kbps, 500Kbps, 1Mbps, and 2Mbps Supports secondary development with a Windows development environment and universal AT instructions Supports serial local upgrade and remote firmware upgrade (FOTA) Rich interfaces including UART, GPIO, ADC, PWM, I2C, I2S, SPI, PDM, and DMA Up to 19 IOs for flexible embedded system integration On-board antenna design for compact wireless product integration SMD-22 package compatible with the 12F series according to the official specification AES-128 hardware encryption support for enhanced wireless security Specifications Parameter Details Brand Ai-Thinker Model PB-03F Core Chip PHY6252 Wireless Standard BLE 5.2 Mesh Support SIG Mesh Package SMD-22 Dimensions 24.0 x 16.0 x 3.1 mm (+/-0.2 mm) Antenna On-board antenna Frequency Range 2400 to 2483.5MHz Power Supply 2.7V to 3.6V, current above 200mA Interfaces UART, SPI, I2C, GPIO, ADC, PWM, I2S, PDM, DMA Available IO Up to 19 UART Rate Default 115200bps Security AES-128 SPI Flash 256KB Operating Temperature -40C to 85C Storage Environment -40C to 125C, less than 90% RH Applications IoT products requiring low-power BLE 5.2 communication and compact wireless integration Smart home devices such as smart lights, smart sockets, and smart air conditioners BLE Mesh networking systems for connected home appliance control Mobile devices, portable electronics, and wearable electronics that benefit from low-power Bluetooth connectivity Embedded systems needing flexible interfaces, FOTA, and secondary development support Other Content Ai-Thinker PB-03F belongs to the official PB Bluetooth module series, which is positioned for smart lights, smart sockets, smart air conditioners, and other connected home appliances. Official PB series materials also highlight direct smartphone Mesh networking, app control, and compatibility with popular smart speaker ecosystems, making the PB-03F suitable for a wide range of BLE smart home applications. Compared with larger PB series members, the PB-03F BLE module focuses on a compact SMD-22 form factor while keeping support for low-power BLE communication, flexible interfaces, and engineering workflows such as AT command integration, secondary development, and firmware upgrade. This makes the Ai-Thinker PB-03F useful for both product development and embedded prototype evaluation. Resources Ai-Thinker PB series official topic page PB-03F specification PHY6252 chip datasheet PB-03F KCC certificate PB-03F SRRC certificate PB-03 series CE RED certificate PB-03 series FCC certificate PB-03F reliability report FAQ Does the PB-03F support BLE Mesh? Yes. According to the official PB series introduction, the Ai-Thinker PB-03F supports SIG Mesh and is suitable for connected smart home and IoT applications. What chip is used in the PB-03F? The PB-03F is based on the PHY6252 BLE SoC, which supports BLE 5.2, low-power operation, and multiple peripheral interfaces. What is the package type of the PB-03F? The official specification lists the Ai-Thinker PB-03F BLE module as an SMD-22 package, and it is described as compatible with the 12F series package style. Does the PB-03F support firmware upgrades and custom development? Yes. Official materials state support for serial local upgrade, remote firmware upgrade (FOTA), AT commands, and secondary development.
