Accessory Compatibility Recommended Not Recommended Build Plate Smooth PEI Plate, Textured PEI Plate Cool Plate SuperTack Hotend All Size / Material / Glue Glue Stick Bambu Liquid Glue Product Features Exceptional Thermal Resistance Excellent Mechanical Properties High Impact Strength and Durability Suitable for Engineering Purpose Comes with High Temperature Reusable Spool Diameter: 1.75mm +/- 0.03mm Cautions for Use Dry out before use AMS Compatible AMS lite NOT Compatible Enclosure Printers Required Recommended Printing Settings Drying Settings (Blast Drying Oven) 80 °C，8h Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant) Nozzle Temperature 250 - 270 °C Bed Temperature (with Glue) 90 - 110 °C Printing Speed < 300 mm/s Physical Properties Density 1.20 g/cm³ Vicat Softening Temperature 119 °C Heat Deflection Temperature 117 °C Melting Temperature 228 °C Melt Index 32.2 ± 2.9 g/10 min Mechanical Properties Tensile Strength 55 ± 4 MPa Breaking Elongation Rate 3.8 ± 0.3 % Bending Modulus 2310 ± 70 MPa Bending Strength 108 ± 4 MPa Impact Strength 34.8 ± 2.1 kJ/m² Printing Tips: • Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC. • Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.
