Hexapod Bones protoboards are designed for hybrid through-hole / surface mount prototyping. Bones KA prototyping boards provide the common 100x100 mil through-hole grid interleaved with a second offset grid. The two grids combined support common 100 mil pitch through-hole components such as switches and potentiometers, along with 50 mil pitch surface mount components. The smaller plated vias on the offset 50 mil grid are connected vertically across the board in bread-board style, for easy connection to SOIC/SOP format devices. Use the bones KA design template (PDF) to layout your circuits. part number HXP-BKA1-G-MG board size 70 x 30 x 1.6mm surface finish ENIG solder mask color matte green through-hole spacing 100 mil (2.54mm) PCB only. The other components shown in examples are not included.
