Intel X3350. Processor family: Intel® Xeon®, Processor socket: LGA 775 (Socket T), Component for: Server/workstation. Market segment: Server, Number of Processing Die Transistors: 820 M, Processing Die size: 214 mm². Package width: 6.18" (157 mm), Package depth: 16.3" (414 mm), Package height: 5.83" (148 mm). Images Type Map: Specification: Processor Processor base frequency 2.83 GHz Processor manufacturer Intel Cooler included Yes Processor codename Yorkfield Thermal Design Power (TDP) 95 W Processor cache 12 MB Processor system type Up Processor ARK ID 33933 Processor model X3360 Processor threads 4 Processor operating modes 64-bit VID Voltage Range 0.85 - 1.3625 V FSB Parity No CPU multiplier (bus/core ratio) 8.5 Bus type FSB Component for Server/workstation Processor lithography 45 nm Processor family Intel® Xeon® Processor front side bus 1333 MHz Processor cores 4 Box Yes Processor socket LGA 775 (Socket T) Processor series Intel Xeon 3300 Series Processor cache type L2 Power Thermal Design Power (TDP) 95 W VID Voltage Range 0.85 - 1.3625 V Technical details Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Hyper Threading Technology (Intel® HT Technology) No Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes Number of Processing Die Transistors 820 M Processing Die size 214 mm² Intel Enhanced Halt State Yes Intel Demand Based Switching No Embedded options available No Product type Processor Processor cache 12288 KB Intel 64 Yes Thermal Design Power (TDP) 95 W Status Discontinued Processor series Intel Xeon 3300 Series Market segment Server Launch date Q1'08 Intel Virtualization Technology (VT-x) Yes Processor cache type L2 Bus type units MHz Bus bandwidth 1333 Processor brand name Intel Xeon Last change 63903513 Product family Intel Xeon Processor 3000 Sequence Bus speed 1333 MHz Features Thermal Design Power (TDP) 95 W Processor package size 37.5 x 37.5 mm Processor ARK ID 33933 Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes Number of Processing Die Transistors 820 M Processing Die size 214 mm² Embedded options available No Market segment Server Images Type Map Harmonized System (HS) code 8542310001 Export Control Classification Number (ECCN) 3A991.A.1 Commodity Classification Automated Tracking System (CCATS) NA Processor special features Intel 64 Yes Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Hyper Threading Technology (Intel® HT Technology) No Enhanced Intel SpeedStep Technology Yes Intel Enhanced Halt State Yes Intel Demand Based Switching No Intel Virtualization Technology (VT-x) Yes Operational conditions Tcase 71.4 °C Packaging data Package width 6.18" (157 mm) Package depth 16.3" (414 mm) Package height 5.83" (148 mm) Package type Retail box Weight & dimensions Processor package size 37.5 x 37.5 mm Package width 6.18" (157 mm) Package depth 16.3" (414 mm) Package height 5.83" (148 mm)
