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BX80646E31230V3 - Intel E3-1230V3 3.30G 4C 80W PROC
USD 325.51
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Intel Xeon E3-1230 v3. Processor family: Intel® Xeon® E3 V3 Family, Processor socket: LGA 1150 (Socket H3), Processor lithography: 22 nm. Memory channels: Dual-channel, Maximum i
nternal memory supported by processor: 32 GB, Memory types supported by processor: DDR3-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.7 GHz. Package width: 2.76" (70 mm), Package depth: 4.57" (116 mm), Package height: 3.98" (101 mm) Specification: Processor Processor base frequency 3.4 GHz Processor manufacturer Intel Cooler included Yes Processor codename Haswell Memory bandwidth supported by processor (max) 25.6 GB/s Thermal Design Power (TDP) 80 W Processor cache 8 MB Processor ARK ID 80910 Processor model E3-1231V3 Processor threads 8 System bus rate 5 GT/s Processor operating modes 64-bit Processor boost frequency 3.8 GHz Stepping C0 Bus type DMI2 Component for Server/workstation Processor lithography 22 nm Processor family Intel® Xeon® E3 V3 Family Processor cores 4 Box Yes Processor socket LGA 1150 (Socket H3) Processor series Intel Xeon E3-1200 v3 Processor cache type Smart Cache Memory Maximum internal memory supported by processor 32 GB Memory types supported by processor DDR3-SDRAM, DDR3L-SDRAM Memory clock speeds supported by processor 1333,1600 MHz Memory bandwidth supported by processor (max) 25.6 GB/s Supported memory types DDR3-SDRAM, DDR3L-SDRAM Memory channels Dual-channel ECC Yes Graphics On-board graphics card model Not available On-board graphics card No Power Thermal Design Power (TDP) 80 W Technical details Intel Stable Image Platform Program (SIPP) Yes Cache memory 8 MB Thermal solution specification PCG 2013D Intel TSX-NI Yes Intel® Secure Key Yes Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Smart Cache Yes Intel® My WiFi Technology (Intel® MWT) No Intel® Identity Protection Technology (Intel® IPT) Yes Intel I/O Acceleration Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel Flex Memory Access Yes Intel Fast Memory Access Yes Intel® Anti-Theft Technology (Intel® AT) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes Intel® Virtualization Technology (Intel® VT) VT-d, VT-x PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Intel VT-x with Extended Page Tables (EPT) Yes Intel Enhanced Halt State Yes Graphics & IMC lithography 22 nm Embedded options available No CPU configuration (max) 1 Product type Processor Processor cache 8192 KB Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Thermal Design Power (TDP) 80 W Supported memory types DDR3-SDRAM, DDR3L-SDRAM Status Discontinued Product name Intel Xeon E3-1231 v3 (8M Cache, 3.40 GHz) Processor series Intel Xeon E3-1200 v3 Market segment Server Launch date Q2'14 Intel Virtualization Technology (VT-x) Yes Intel Stable Image Platform Program (SIPP) version 1.00 Intel Secure Key Technology version 1.00 Intel Identity Protection Technology version 1.00 Processor cache type Smart Cache Bus type units GT/s Bus bandwidth 5 Born on date Q2'14 Maximum memory 32 GB Intel TSX-NI version 1.00 Processor brand name Intel Xeon v2 Last change 63903513 Product family Intel Xeon Processor E3 v3 Family Bus speed 5 GT/s Features Maximum number of PCI Express lanes 16 Thermal Design Power (TDP) 80 W Processor package size 37.5 x 37.5 mm Processor ARK ID 80910 Thermal solution specification PCG 2013D Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes PCI Express slots version 3.0 PCI Express configurations 1x16, 2x8, 1x8+2x4 Supported instruction sets SSE4.1, SSE4.2, AVX 2.0 Scalability 1S Graphics & IMC lithography 22 nm Embedded options available No CPU configuration (max) 1 Market segment Server Harmonized System (HS) code 8542310001 Export Control Classification Number (ECCN) 5A992C Commodity Classification Automated Tracking System (CCATS) G077159 PCI Express CEM revision 3.0 Processor special features Intel Virtualization Technology for Directed I/O (VT-d) Yes Intel 64 Yes Conflict-Free processor No Intel® OS Guard Yes Intel Stable Image Platform Program (SIPP) Yes Intel TSX-NI Yes Intel® Secure Key Yes Intel® Turbo Boost Technology 2.0 Intel Trusted Execution Technology Yes Intel® Smart Cache Yes Intel® My WiFi Technology (Intel® MWT) No Intel® Identity Protection Technology (Intel® IPT) Yes Intel I/O Acceleration Technology Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel Flex Memory Access Yes Intel Fast Memory Access Yes Intel® Anti-Theft Technology (Intel® AT) Yes Intel® AES New Instructions (Intel® AES-NI) Yes Enhanced Intel SpeedStep Technology Yes Intel® Virtualization Technology (Intel® VT) VT-d, VT-x Intel VT-x with Extended Page Tables (EPT) Yes Intel Enhanced Halt State Yes Intel Virtualization Technology (VT-x) Yes Intel Stable Image Platform Program (SIPP) version 1.00 Intel Secure Key Technology version 1.00 Intel Identity Protection Technology version 1.00 Intel TSX-NI version 1.00 Intel® vPro™ Platform Eligibility Yes Intel® Turbo Boost Technology 2.0 frequency 3.8 GHz Intel® Transactional Synchronization Extensions Yes Packaging data Package width 2.76" (70 mm) Package depth 4.57" (116 mm) Package height 3.98" (101 mm) Package weight 13.2 oz (373 g) Package type Retail box Weight & dimensions Processor package size 37.5 x 37.5 mm Package width 2.76" (70 mm) Package depth 4.57" (116 mm) Package height 3.98" (101 mm) Package weight 13.2 oz (373 g) Other features Cache memory 8 MB Intel® Virtualization Technology (Intel® VT) VT-d, VT-x Maximum internal memory 32 GB Maximum internal memory 32768 MB CPU configuration (max) 1
