CAIG SILICONE-BASED HEAT SINK COMPOUND

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Description Silicone Heat Sink Compound 6g Squeeze Tube Transfer Heat Away from Electronic Components and Parts Thermally conductive compounds are grease like silicone materials, h eavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. A cooler device allows for more efficient operation and better reliability over the life of the device. Thermally conductive materials act as a thermal bridge to remove heat from a heat source (device) to the ambient via a heat transfer media (i.e. heat sink). USE: Apply to all mounting and threaded surfaces of the device and chassis. CONTAINS: Zinc oxide and polydimethyl siloxane. Specifications Thermal Conductivity: 0.67 Watts per meter K Specific Gravity: 2.1 @25°C Silicone and Zinc Oxides Viscosity: 542000 maps Shelf Life: 60 months Applications Transfer heat away from heat sinks, transistors, power diodes, semiconductors ballasts & thermocouple wells. . Made in China.FEATURES Package Dimensions: 3 L x 0.5 H x 0.5 W (inches) Package Weight : 0.06 pounds Country of Origin : China Part number: HSC67-6G Show more