Hexapod Carnival protoboards are designed for direct surface mount prototyping. The pads have a horizontal pitch of 50-mil (1.27mm), which works well for components using SOIC, SOT-23, TO-252, 0603 and 1206 footprints. Carnival prototyping boards have a 4-layer design where the central pads are connected through to the back side of the board using vias-in-pads PCB fabrication technology. Once an IC is soldered to the front of the board, the matching pads on the back make it easy to route signals to through-hole connections on the left and right. Carnival boards also have top-bottom connectivity via opposing teeth. Carnival boards are good for logic and microcontroller circuits where a large fraction of the IC pins will be connected to through-hole headers. Use the carnival A design template (PDF) to layout your circuits. part number HXP-CAA2-G-MG board size 70 x 30 x 1.6mm surface finish ENIG solder mask color matte green through-hole spacing 100 mil (2.54mm) central pad pitch (center to center) 50 mil (1.27mm) central pad gap (copper to copper) 12 mil (0.305mm) PCB only. The other components shown in examples are not included.
