Chip Quik SMD1 — Leaded SMD Removal Kit | Low-Melt ChipQuik Alloy | 58°C (136°F) Melting Point The Chip Quik SMD1 is the original leaded SMD removal kit — the fast, reliable solution for removing surface-mount components from PCBs without heat damage to the board or adjacent components. The kit uses a proprietary low-melt ChipQuik alloy that blends with existing solder on component leads, dramatically lowering the melting point so all leads of a multi-pin SMD component can be simultaneously removed in a single smooth motion with a standard soldering iron. No hot air gun required. Kit includes 2.5ft of ChipQuik leaded low-melt alloy, SMD291 no-clean tack flux, and alcohol cleaning pads. Ideal for prototyping, rework, repair, and field service operations. ⚠️ California Prop 65 Warning: This product can expose you to Lead, which is known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information, visit www.P65Warnings.ca.gov. Kit Contents ChipQuik Low-Melt Alloy 2.5ft leaded alloy wire Flux SMD291 no-clean tack flux Cleaning Pads Alcohol pads Specifications Part Number SMD1 Alloy Type Leaded (contains lead) ChipQuik Alloy Melting Point 58°C (136°F) Alloy Quantity 2.5ft Flux Type SMD291 no-clean tack flux Shelf Life >24 months refrigerated or unrefrigerated Manufacturer Chip Quik Key Features No hot air required — removes SMD components using only a standard soldering iron; no hot air rework station needed, making it ideal for field service and low-volume rework Ultra-low melt point — 58°C (136°F) — ChipQuik alloy blends with existing solder to lower the melting point dramatically, allowing all leads to remain liquid simultaneously while the component is slid off the board No heat damage to PCB or components — the low processing temperature prevents delamination, pad lift, and thermal stress to the PCB and adjacent components Works on all SMD package types — SOICs, QFPs, PLCCs, SOTs, resistors, capacitors, and other surface-mount packages SMD291 no-clean tack flux included — activates the ChipQuik alloy and promotes wetting; no-clean formula leaves minimal residue that does not require cleaning Long shelf life — >24 months shelf life refrigerated or unrefrigerated; store at room temperature Industries & Applications PCB rework and repair — removing damaged, misplaced, or end-of-life SMD components during production and repair operations Electronics prototyping — recovering expensive components from prototype boards for reuse Field service and depot repair — SMD removal without hot air rework equipment in field or low-infrastructure environments Electronics manufacturing — rework of QFP, PLCC, SOIC, and other fine-pitch packages during production Education and training — safe, low-temperature SMD removal for electronics training labs Documentation Technical Data Sheet (TDS) — Chip Quik SMD1 Safety Data Sheet (SDS) — Chip Quik SMD1 Frequently Asked Questions How does Chip Quik SMD removal work? Apply SMD291 tack flux to the component leads, then melt ChipQuik low-melt alloy onto all leads using a standard soldering iron. The ChipQuik alloy blends with the existing solder, lowering its melting point to approximately 58°C (136°F). With all leads still molten, simply slide the component off the PCB in one smooth motion. Clean residual ChipQuik alloy with the included alcohol pads and standard solder before reinstallation. What is the difference between SMD1 (leaded) and SMD1NL (lead-free)? The SMD1 kit uses a leaded ChipQuik alloy and is designed for use on leaded (SnPb) solder assemblies. The SMD1NL is the lead-free version, designed for RoHS-compliant lead-free assemblies. Always match the alloy type to your board’s solder chemistry — using leaded ChipQuik on a lead-free assembly (or vice versa) can cause compatibility issues and leave contamination. Do I need a hot air rework station to use Chip Quik? No — Chip Quik is specifically designed to work with a standard soldering iron only. This makes it uniquely useful for field service, prototype labs, and low-volume repair operations where a hot air rework station is not available. A standard iron tip temperature of 350°C (660°F) is recommended. What SMD package types can be removed with SMD1? Chip Quik SMD1 works with virtually all SMD package types including SOICs, QFPs, PLCCs, SOTs, 0402/0603/0805 passives, tantalum capacitors, and other surface-mount components. It is particularly effective for fine-pitch QFP and PLCC packages where simultaneous lead melting is critical. Is the flux residue from SMD291 safe to leave on the board? Yes — SMD291 is a no-clean tack flux, meaning its residue is non-conductive and non-corrosive and does not require cleaning under normal conditions. For high-reliability applications or conformal coating, cleaning with isopropyl alcohol is recommended before coating.
