CP80617004116AH - Intel CORE I3-380M

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Intel Core i3-380M. Processor family: Intel® Core™ i3, Processor socket: PGA988, Processor lithography: 32 nm. Memory channels: Dual-channel, Maximum internal memory supported b y processor: 8 GB, Memory types supported by processor: DDR3-SDRAM. On-board graphics adapter model: Intel® HD Graphics, On-board graphics adapter base frequency: 500 MHz, On-board graphics adapter dynamic frequency (max): 667 MHz. Market segment: Mobile, PCI Express configurations: 1x16, Number of Processing Die Transistors: 382 M. Processor package size: 37.5mm x 37.5mm; 34mm x 28mm Specification: Processor Processor generation Intel® Core™ i3 Processor base frequency 2.4 GHz Processor manufacturer Intel Cooler included No Processor codename Arrandale Memory bandwidth supported by processor (max) 17.1 GB/s Thermal Design Power (TDP) 35 W Processor cache 3 MB Processor ARK ID 49020 Processor model i3-370M Processor threads 4 System bus rate 2.5 GT/s Processor operating modes 64-bit Stepping K0 L3 cache speed 2.4 GHz CPU multiplier (bus/core ratio) 18 Bus type DMI Component for Notebook Processor lithography 32 nm Processor family Intel® Core™ i3 Processor cores 2 Box No Processor socket PGA988 Processor code SLBUK Processor series Intel Core i3-300 Mobile Series Processor cache type Smart Cache Generation 3rd Generation Memory Maximum internal memory supported by processor 8 GB Memory types supported by processor DDR3-SDRAM Memory clock speeds supported by processor 800,1066 MHz Memory bandwidth supported by processor (max) 17.1 GB/s Supported memory types DDR3-SDRAM Memory channels Dual-channel ECC No Graphics Number of displays supported (on-board graphics) 2 On-board graphics card model Intel® HD Graphics On-board graphics card Yes On-board graphics card dynamic frequency (max) 667 MHz On-board graphics card base frequency 500 MHz Power Thermal Design Power (TDP) 35 W Technical details Cache memory 3 MB Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Smart Cache Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel Flex Memory Access Yes Intel FDI Technology Yes Intel Fast Memory Access Yes Intel Dual Display Capable Technology Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) No Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes Intel® Virtualization Technology (Intel® VT) VT-x PCI Express slots version 2.0 PCI Express configurations 1x16 Number of Processing Die Transistors 382 M Processing Die size 81 mm² Number of Graphics & IMC Die Transistors 177 M Graphics & IMC Die Size 114 mm² Supported instruction sets SSE4.1, SSE4.2 Physical Address Extension (PAE) Yes L3 cache speed 2.4 GHz Intel VT-x with Extended Page Tables (EPT) Yes Intel Enhanced Halt State Yes Graphics & IMC lithography 45 nm Embedded options available No CPU configuration (max) 1 Processor code SLBUK Product type Processor Processor cache 3072 KB Intel Virtualization Technology for Directed I/O (VT-d) No Intel 64 Yes Thermal Design Power (TDP) 35 W Supported memory types DDR3-SDRAM Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) Yes Status Discontinued Product name Intel Core i3-370M (3M cache, 2.40 GHz) Processor series Intel Core i3-300 Mobile Series Physical Address Extension (PAE) 36 bit Market segment Mobile Launch date Q3'10 Intel Virtualization Technology (VT-x) Yes Graphics max dynamic frequency 667 MHz Processor cache type Smart Cache Bus type units GT/s Bus bandwidth 2.5 Born on date Q3'10 Maximum memory 8 GB Processor brand name Intel Core i3 Last change 63903513 Product family Previous Generation Intel Core i3 Processor Bus speed 2.5 GT/s Features Maximum number of PCI Express lanes 16 Thermal Design Power (TDP) 35 W Processor package size 37.5mm x 37.5mm; 34mm x 28mm Processor ARK ID 49020 Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes PCI Express slots version 2.0 PCI Express configurations 1x16 Number of Processing Die Transistors 382 M Processing Die size 81 mm² Number of Graphics & IMC Die Transistors 177 M Graphics & IMC Die Size 114 mm² Supported instruction sets SSE4.1, SSE4.2 Physical Address Extension (PAE) Yes Graphics & IMC lithography 45 nm Embedded options available No CPU configuration (max) 1 Processor code SLBUK Physical Address Extension (PAE) 36 bit Market segment Mobile Harmonized System (HS) code 8542310001 Export Control Classification Number (ECCN) 3A991 Commodity Classification Automated Tracking System (CCATS) NA PCI Express CEM revision 2.0 Processor special features Macrovision License Required No Intel Clear Video Technology Yes Intel Virtualization Technology for Directed I/O (VT-d) No Intel 64 Yes Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Smart Cache Yes Intel® Hyper Threading Technology (Intel® HT Technology) Yes Intel Flex Memory Access Yes Intel FDI Technology Yes Intel Fast Memory Access Yes Intel Dual Display Capable Technology Yes Intel® Clear Video HD Technology (Intel® CVT HD) Yes Intel® AES New Instructions (Intel® AES-NI) No Enhanced Intel SpeedStep Technology Yes Intel® Virtualization Technology (Intel® VT) VT-x Intel VT-x with Extended Page Tables (EPT) Yes Intel Enhanced Halt State Yes Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID) Yes Intel Virtualization Technology (VT-x) Yes Intel® vPro™ Platform Eligibility No Operational conditions Tjunction 105 °C Weight & dimensions Processor package size 37.5mm x 37.5mm; 34mm x 28mm Other features Cache memory 3 MB Intel® Virtualization Technology (Intel® VT) VT-x Maximum internal memory 8 GB Maximum internal memory 8192 MB CPU configuration (max) 1 Processor code SLBUK Show more