King-Ning TuCambridge University Press, 11/25/2010EAN 9780521516136, ISBN10: 0521516137Hardcover, 500 pages, 25.4 x 18 x 2.3 cmLanguage: EnglishThin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.1. Thin film applications to microelectronic technology2. Thin film deposition3. Surface energy in thin films4. Atomic diffusion in crystalline solids5. Applications of diffusion equation6. Elastic stress and strain in thin films7. Surface kinetic processes on thin films8. Interdiffusion and reaction in thin films9. Grain boundary diffusion10. Irreversible processes in interconnect and packaging technology11. Electromigration in metals12. Electromigration induced failure in Al and Cu interconnects13. Thermomigration14. Stress migration in thin films15. Reliability science and analysisAppendicesA. A brief review of thermodynamic functionsB. Defect concentration in solidsC. Step-by-step derivation of Huntington's electron wind forceD. Elastic constants tables and conversionsE. Terrace size distribution in Si MBEF. Interdiffusion coefficientG. Units, tables of conversions, period table.