EU80574KJ080NT - Intel XEON X5450

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Intel Xeon X5450. Processor socket: LGA 771 (Socket J), Processor lithography: 45 nm, Processor manufacturer: Intel. Market segment: Server, Number of Processing Die Transistors: 8 20 M, Processing Die size: 214 mm². Package width: 6.18" (157 mm), Package depth: 15.2" (387 mm), Package height: 6.81" (173 mm). Processor package size: 37.5 x 37.5 mm. Images Type Map: Specification: Processor Processor base frequency 3.16 GHz Processor manufacturer Intel Cooler included No Thermal Design Power (TDP) 120 W Processor cache 12 MB Processor ARK ID 33087 Processor model X5460 Processor threads 4 Processor operating modes 64-bit VID Voltage Range 0.85 - 1.35 V FSB Parity Yes CPU multiplier (bus/core ratio) 9.5 Bus type FSB Component for Server/workstation Processor lithography 45 nm Processor front side bus 1333 MHz Processor cores 4 Box No Processor socket LGA 771 (Socket J) Processor series Intel Xeon 5400 Series Processor cache type L2 Power Thermal Design Power (TDP) 120 W VID Voltage Range 0.85 - 1.35 V Technical details Thermal Monitoring Technologies Yes Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Hyper Threading Technology (Intel® HT Technology) No Idle States Yes Execute Disable Bit Yes Enhanced Intel SpeedStep Technology Yes Number of Processing Die Transistors 820 M Processing Die size 214 mm² Intel VT-x with Extended Page Tables (EPT) No Intel Enhanced Halt State Yes Intel Demand Based Switching Yes Embedded options available No Product type Processor Processor cache 12288 KB Intel 64 Yes Thermal Design Power (TDP) 120 W Status Discontinued Processor series Intel Xeon 5400 Series Market segment Server Launch date Q4'07 Intel Virtualization Technology (VT-x) Yes Processor cache type L2 Bus type units MHz Bus bandwidth 1333 Processor brand name Intel Xeon Last change 63903513 Product family Intel Xeon Processor 5000 Sequence Bus speed 1333 MHz Features Thermal Design Power (TDP) 120 W Processor package size 37.5 x 37.5 mm Processor ARK ID 33087 Thermal Monitoring Technologies Yes Idle States Yes Execute Disable Bit Yes Number of Processing Die Transistors 820 M Processing Die size 214 mm² Embedded options available No Market segment Server Images Type Map Harmonized System (HS) code 8542310001 Export Control Classification Number (ECCN) 3A991.A.1 Commodity Classification Automated Tracking System (CCATS) NA Processor special features Intel 64 Yes Conflict-Free processor No Intel® Turbo Boost Technology No Intel Trusted Execution Technology No Intel® Hyper Threading Technology (Intel® HT Technology) No Enhanced Intel SpeedStep Technology Yes Intel VT-x with Extended Page Tables (EPT) No Intel Enhanced Halt State Yes Intel Demand Based Switching Yes Intel Virtualization Technology (VT-x) Yes Operational conditions Tcase 63 °C Packaging data Package type Retail box Weight & dimensions Processor package size 37.5 x 37.5 mm Show more