Hexapod Festival protoboards are designed for direct surface mount prototyping. The pads have a horizontal pitch of 50-mil (1.27mm), which works well for components using SOIC, SOT-23, TO-252, 0603 and 1206 footprints. Festival W boards are a wider version of Festival A, and use an enhanced form of the Ritual design. Four separate signal lines run along the top and bottom of the board, for eight lines in total. Signal lines are selected by soldering a short (2mm) piece of uninsulated wire from the signal pad to an adjacent distribution pad. This rich cross-board connectivity allows circuits to be build up in connected modules without needing jumper wires crossing left and right over the board. The face is the distribution pad. Clockwise from the top we then have hat, lamp, cone, cup and shade. All the hats are ground. All the lamps along the top edge of the board are connected together, so are all the cones, cups and shades thus connected. The sigils along the bottom edge of the board form their own independent set. Use the festival W design template (PDF) to layout your circuits. part number HXP-FAW2-G-MG board size 70 x 40 x 1.6mm surface finish ENIG solder mask color matte green through hole spacing 100 mil (2.54mm) central pad pitch (center to center) 50 mil (1.27mm) central pad gap (copper to copper) 12 mil (0.305mm) PCB only. The other components shown in examples are not included.
