Incure Epo-Weld™ 5140 Fast-Cure Epoxy for Flip-Chip and Electronic Device Packaging

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Incure Epo-Weld™ 5140 is a one-component epoxy adhesive for rework and electronic devices. It offers a fast cure at high temperature and develops tough, strong structural bonds wit h excellent shear, peel, and impact strength. It is well-suited for the flip-chip underfill packaging process, as it can quickly fill the gap between the wafer and the complete package.Key Features: Fast Cure at High Temp: Reduces working time. Flip-Chip Underfill: Specifically suited for this packaging process. High Strength: Provides tough, strong structural bonds. High Durability: Passes many environmental tests. Color: Black. Pot Life: 3-5 days. Show more