The GigaDevice GD32VW553H-EVAL Evaluation Board is an evaluation platform for GigaDevice's GD32VW553 wireless MCU family. The GD32VW553 series combines a RISC-V core with Wi-Fi 6 and Bluetooth LE connectivity for IoT, smart-home, industrial interconnection, and wireless gateway development. GigaDevice's current official GD32VW553 series page lists Wi-Fi 6 with IEEE 802.11 b/g/n/ax HT20, Bluetooth LE 5.2, a 160 MHz RISC-V processor core, up to 4 MB Flash, 320 KB SRAM, 1.8 V to 3.6 V supply range, and support for temperatures up to 105 C. Although the product title includes Bluetooth 5.3, the body description follows GigaDevice's official current documentation and uses Bluetooth LE 5.2. Features GD32VW553 evaluation platform - Designed for wireless MCU development and system-level evaluation. RISC-V core - Official data lists up to 160 MHz operation. Wi-Fi 6 connectivity - Supports IEEE 802.11 b/g/n/ax HT20 according to GigaDevice documentation. Bluetooth LE 5.2 - Official GD32VW553 documentation lists Bluetooth LE 5.2 wireless connectivity. Large embedded memory - Up to 4 MB Flash and 320 KB SRAM in the GD32VW553 series. RTOS and SDK support - GigaDevice provides the GD32VW55x Wi-Fi and BLE SDK for wireless application development. Security resources - Official series data lists CAU, HAU, TRNG, CRC, ECC, and EFUSE security-related resources. Universal wired interfaces - The series includes common interfaces for sensors, displays, and host integration. Wide supply range - Official series data lists 1.8 V to 3.6 V. High-temperature support - Official data states support for temperatures up to 105 C. Specifications Parameter Value Product Model GD32VW553H-EVAL MCU Family GD32VW553 wireless MCU family CPU Core RISC-V Maximum Frequency 160 MHz Flash Memory in Series Up to 4096 KB SRAM in Series 320 KB Wi-Fi Wi-Fi 6, IEEE 802.11 b/g/n/ax HT20 Bluetooth Bluetooth LE 5.2 per official current GD32VW553 documentation Supply Voltage 1.8 V to 3.6 V Security Resources CAU, HAU, TRNG, CRC, ECC, EFUSE listed by official series page Temperature Support Up to 105 C according to official series overview Reference Documents GigaDevice GD32VW553 Series official page GigaDevice GD32VW553 official product page Application Wireless MCU evaluation - Useful for evaluating GD32VW553 Wi-Fi 6 and BLE firmware workflows. Smart-home devices - Wi-Fi and BLE resources suit appliances, panels, and connected home products. Industrial interconnection - High-temperature support and wireless connectivity suit industrial IoT prototypes. Communication gateways - Wi-Fi 6 and BLE support gateway and bridge applications. Lighting equipment - The GD32VW553 series is positioned for connected lighting and socket-panel applications. Office equipment - Suitable for wireless peripheral and device connectivity evaluation. Payment terminals - Security resources and wireless connectivity support connected terminal studies. Wireless embedded education - A practical platform for RISC-V, Wi-Fi 6, BLE, RTOS, and SDK learning. Packing List 1 x GigaDevice GD32VW553H-EVAL evaluation board FAQ Does this product title say Bluetooth 5.3? Yes, the product title includes Bluetooth 5.3. However, GigaDevice's current official GD32VW553 documentation lists Bluetooth LE 5.2, so the body description follows the official source. What CPU architecture does GD32VW553 use? The GD32VW553 series uses a RISC-V processor core. What is the maximum frequency? Official data lists up to 160 MHz. Does it support Wi-Fi 6? Yes. Official data lists IEEE 802.11 b/g/n/ax HT20. How much memory is available? The GD32VW553 series integrates up to 4 MB Flash and 320 KB SRAM. What SDK is used? GigaDevice provides the GD32VW55x Wi-Fi and BLE SDK. Is this board suitable for industrial IoT? Yes. Wireless connectivity, security resources, and high-temperature support make it suitable for industrial IoT evaluation. Why are LCD, audio, or camera accessories not listed? Only confirmed physical contents are listed. Unverified board accessories are intentionally omitted.
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