Q²M Compound+ REDEFINED is a heavy cutting paste that delivers improved scratch removal and high abrasion with almost no dust and limited secondary defects. Although it does leave light holograms, they are simple to remove with one pass of Q²M Polish. Q²M Compound+ REDEFINED delivers increased cutting power without the usual price of enormous defects. The water-based formula contains high-quality Japanese abrasives that allow fast and easy removal of harsh defects. No silicone or fillers make pre-coating preparation and polish removal much faster and easier. PRO TIP: Q²M Compound+ REDEFINED is unlike any other cutting polish. With its water base, speed and temperature should be reduced for the best results. Work in small sections, moving the machine slowly across the surface. TIP: Compared to its previous version, Q²M Compound+ REDEFINED retains a high level of cutting, driving a longer working cycle without drying out. It is ideal for high-temperature and humid climates. Consumption: 15-40ML/PANEL Size: 250ml
