カテゴリ: 論文誌(論文単位)グループ名: 【D】産業応用部門（英文）発行日: 2020/05/01タイトル(英語): Mission-Profile-Based Testing Scheme for Sub-Modules in Modular Multilevel Converter著者名: Yunxiao Yang (Department of Electrical Engineering, Shanghai Jiao Tong University), Weiyao Wang (Department of Electrical Engineering, Shanghai Jiao Tong University), Ke Ma (Department of Electrical Engineering, Shanghai Jiao Tong University)著者名(英語): Yunxiao Yang (Department of Electrical Engineering, Shanghai Jiao Tong University), Weiyao Wang (Department of Electrical Engineering, Shanghai Jiao Tong University), Ke Ma (Department of Electrical Engineering, Shanghai Jiao Tong University)キーワード: mission profile emulator，modular multilevel converter，sub-modules，carrier phase-shift pulse width modulation要約(英語): Modular multilevel converter (MMC) has been widely used in medium/high-voltage direct current transmission, motor drive, and renewable energy power generation. The reliability requirements of the MMC system, which is composed of numerous sub-modules (SMs) as building blocks, are getting crucial. However, the testing for reliability of SMs in a full MMC system is time-consuming and costly. In this paper, a mission profile emulator for SMs in the MMC system is therefore focused; by using this mission profile emulator, the SMs can be tested individually without building a full MMC system. Simulation results have shown that arm current and capacitor voltage of the SM under test agree well with the SM in a complete MMC system. A scaled-down experimental platform is built and experimental results have proved the validity of this emulator.本誌: IEEJ Journal of Industry Applications Vol.9 No.3 （2020） Special Issue on “SPC-Power Electronics and Its Applications”本誌掲載ページ: 219-226 p原稿種別: 論文／英語電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejjia/9/3/9_219/_article/-char/ja/
