High Sensitive TSP for Optical Readout Infrared Thermal Imaging Devices

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カテゴリ: 論文誌(論文単位)グループ名: 【E】センサ・マイクロマシン部門発行日: 2016/10/01タイトル(英語): High Sensitive TSP for Optical Readout Infrared Thermal Imaging Devices著者名: Min Wang (Graduate School of Engineering, Tohoku University), Takashiro Tsukamoto (Graduate School of Engineering, Tohoku University), Shuji Tanaka (Graduate School of Engineering, Tohoku University)著者名(英語): Min Wang (Graduate School of Engineering, Tohoku University), Takashiro Tsukamoto (Graduate School of Engineering, Tohoku University), Shuji Tanaka (Graduate School of Engineering, Tohoku University)キーワード: temperature sensitive paint，Eu(TTA)3，thermal quenching要約(英語): This paper reports the sensitivity of various Eu(TTA)3-based temperature sensitive paints (TSPs) which can be used in an infrared thermal imaging device. Two types of polymer binders (PSAMS and PVB) mixing with various concentration of Eu(TTA)3 were prepared and examined. The TSP using PSAMS had a higher temperature sensitivity compared with that using PVB when the temperature was less than 38oC. The maximum sensitivity as high as 9.0%/ oC was obtained by mixing 360 mg of Eu(TTA)3 with 1 g of PSAMS. The theoretical model of a thermal imaging device reveals that the temperature sensitivity of TSP has a great impact on the performance of the thermal imaging device. A NETD as small as 0.16 K can be obtained by using the high sensitive TSP developed here.本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.136 No.10 （2016）本誌掲載ページ: 443-447 p原稿種別: 論文／英語電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/136/10/136_443/_article/-char/ja/ Show more