カテゴリ: 論文誌(論文単位)グループ名: 【E】センサ・マイクロマシン部門発行日: 2024/11/01タイトル(英語): Development of Assembly Techniques for Miniaturized in-line Pressure Sensor by Utilizing Thin Strain Sensor for High Reliability著者名: 池田 裕（（株）日立製作所 研究開発グループ），金丸 昌敏（（株）日立製作所 研究開発グループ），青野 宇紀（（株）日立製作所 研究開発グループ）著者名(英語): Hiroshi Ikeda (Research & Development Group, Connective Automation Innovation Center, Robotics Research Department, Hitachi, Ltd.), Masatoshi Kanamaru (Research & Development Group, Connective Automation Innovation Center, Robotics Research Department, Hitachi, Ltd.), Takanori Aono (Research & Development Group, Connective Automation Innovation Center, Robotics Research Department, Hitachi, Ltd.)キーワード: ウエハレベルパッケージング，ひずみセンサ，圧力センサ，実装技術，押圧機構 wafer-level-packaging，strain-sensor，pressure sensor，assembly technique，pressing mechanism要約(英語): High reliability assembly techniques for miniaturized in-line pressure sensor with diaphragm using a thin strain sensor have been developed to monitor the hydraulic pressure in the pipetting such as dispensing devices. The pressure sensor with a thin strain sensor as a diaphragm has two problems, (i) water leakage and (ii) sensitivity reduction by adding hydraulic pressure. These problems were clarified to generate tensile stress in the adhesive (Ag paste) by adding hydraulic pressure and to peel strain sensor from SUS housing. To overcome these problems, the stress in Ag paste was needed to keep compressive stress even when adding pressure. In this paper, a pressing mechanism is newly proposed to make compressive stress in Ag paste and assemble on the pressure sensor. First, to press the strain sensor to the SUS housing, a cap was bonded on the strain sensor with wafer-level-packaging (WLP) technique. Next, a pressing mechanism was designed to assemble on the miniaturized pressure sensor. The pressing mechanism was composed of a cover, two coil springs, and a spring base with pressing point. The pressing mechanism generates compressive stress to Ag paste even under high hydraulic pressure. The pressure sensor which implements the pressing mechanism has high pressure resistance and high reliability under the repetitive hydraulic pressure of 10 million times, without water leakage and sensitivity decrease.本誌: 電気学会論文誌E（センサ・マイクロマシン部門誌） Vol.144 No.11 （2024） 特集：化学物質の高次センシングと解析技術本誌掲載ページ: 357-363 p原稿種別: 論文／日本語電子版へのリンク: https://www.jstage.jst.go.jp/article/ieejsmas/144/11/144_357/_article/-char/ja/
