K‑Bond Universal – Light‑Cured Universal Bonding Agent

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A light-cured universal dental adhesive designed for flexible bonding across total-etch, selective-etch, and self-etch protocols. ⭐ Three Etching Modes Compatible with total-etch, selective-etch, and self-etch techniques for flexible restorative workflows. ⭐ No Separate Dual-Cure Activator Designed to bond with dual-cure and self-cure restorative materials without a separate activator. ⭐ 10-MDP + Multiple Initiator System Formulated with 10-MDP and a multiple-initiator system to support reliable bonding to enamel, dentin, and restorative substrates. ⭐ Low Film Thickness Approximately 6 μm film thickness in SPIDENT R&D internal testing, supporting a thin adhesive layer and marginal fit. Why Clinicians Choose K-Bond Universal ✔ Total-etch, selective-etch, and self-etch compatibility ✔ Dual-cure and self-cure compatibility without a separate activator ✔ 10-MDP-based universal adhesive formulation ✔ Designed for direct bonding, repair, indirect luting, and hypersensitivity treatment K-Bond Universal is a light-cured universal dental adhesive formulated with 10-MDP and a multiple-initiator system. It is compatible with total-etch, selective-etch, and self-etch protocols, allowing clinicians to select an etching approach according to the restorative procedure. With a mild pH of 3.5, K-Bond Universal is designed for compatibility with dual-cure and self-cure restorative materials without requiring a separate activator. Its hydrophilic characteristics before light curing support penetration into dentin, while the adhesive becomes hydrophobic after curing. Indications listed by SPIDENT include direct bonding, repair cases, indirect luting, and hypersensitivity treatment. SPIDENT R&D internal testing also reports a low adhesive film thickness of approximately 6 μm. K-Bond Universal is supplied in a 5 mL bottle. Complete your restorative workflow with: EsFlow® PLUS Injectable EsFlow® LV EsCom 250 Universal Composite Show more