Multicomp Typ 505 solid fluxes for cored solder wires have been specially formulated to complement no clean wave and reflow soldering processes. They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning. Multicomp flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of fluxe 505 means, they are also well suited to soldering requiring high melting temperature alloys.Mildly activated no-clean flux formulationIncreased flux content (3% by weight) - low fuming and low spittingMinimal clear residues do not require cleaningComplies with all lead-free legislative requirementsSuitable for general lead-free, no-clean assembly, or rework of PCBs assembled in a lead-free no-clean processLead Free. Material Composition: 99.3% Tin, 0.7% Copper. Resin based flux, halide activated, low activation levelLeaded / Lead Free: Lead FreeFlux Type: No Clean and Rosin FluxSolder Alloy: 99.3, 0.7 Sn, CuExternal Diameter: 0.7mmMelting Temperature: 227°CWeight: 500gMulticomp Type 505 Solder Wire
Related
Related
Related
Related