This high-quality 35g Leaded Solder Paste is formulated with a precise blend of Sn63/Pb37 alloy, flux, and advanced additives for strong, reliable solder joints. Designed for mobile phone repair, computer servicing, high-precision circuit boards, and SMT/BGA soldering, it offers excellent wetting, smooth flow, and long-lasting adhesion. Ideal for professional and electronic repair use. Main Features: Premium Sn63/Pb37 composition ensures smooth soldering and strong connections Low melting point (183°C) for efficient and safe operation Excellent wetting and high adhesion for precision soldering Ideal viscosity stability — usable up to 48 hours after preparation RoHS compliant and suitable for fine electronic and PCB work Consistent performance across SMT, BGA, and micro-soldering applications Suitable for professional repair environments and electronic workshops Specifications: Material: Sn-Pb alloy (Sn63/Pb37) Melting Point: 183°C Net Weight: 35g tub Certification: RoHS Compliant Viscosity Duration: Up to 48 hours Operating Temperature: 22–28°C Recommended Humidity: RH 30–60% Applications: Mobile phone, computer repair, high-precision circuit boards, SMT/BGA soldering
