Features: Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board Concentrated fine copper braiding utilizes less length of wick for each desoldering application Made of clean, oxide-free copper wire Tight weave enables quick “on and off” desoldering Formulated with a flux designed for higher activation temperatures To be used in conjunction with processes using RMA type no-clean fluxes 5’ and 10’ lengths available on static dissipative bobbins in compliance with ESD Association Standard Leaves a residue that is environmentally safe Uses flux classification type L0 per IPC J-STD-004B Wire Specifications: Wire Type Width Configuration A Wire 0.025” (±0.003”) .635mm (±0.08mm) 2 strands of 42awg X 16 (total 32 strands), 31 PPI B Wire 0.050” (±0.004”) 1.27mm (±0.10mm) 4 strands of 42awg X 16 (total 64 strands), 12.5 PPI C Wire 0.075” (±0.005”) 1.90mm (±0.13mm) 6 strands of 42awg X 16 (total 96 strands), 16 PPI D Wire 0.095” (±0.007”) 2.41mm (±0.18mm) 5 strands of 42awg X 24 (120 total strands), 19 PPI E Wire 0.117” (±0.008”) 2.97mm (±0.20mm) 5 strands of 40awg X 24 (120 total strands), 16 PPI Bobbin Identification: Width Color Code Letter Signifier .025” Gray A .050” Yellow B .075” Green C .100” Blue D .125” Brown E Micro-Tools makes every attempt to provide accurate information for each item. Actual packaging and/or specifications may be slightly different from the information and picture provided.