Mijing MS1 Universal Module for iPhone16

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The Mijing iRepair MS1 Universal Module for iPhone 16 series expands the MS1 desoldering platform to cover the newest iPhone 16, 16 Plus, 16 Pro, 16 Pro Max, and 16e motherboards. Built as a precision-fit heating attachment, the module locks onto the MS1 base station and delivers accurate, layer-specific heat for safe board separation during dead phone repair, hardware fault diagnosis, and IC-level rework. It supports the digital temperature display and intelligent sleep function already built into the MS1 base, giving technicians a repeatable, damage-free way to open up iPhone 16 series boards without guessing heat levels. This module is a direct upgrade for shops already running the MS1 system and expanding into iPhone 16 repair jobs. Show more