No-Clean BGA Solder Paste (10cc) (different sets available)

Action Outdoors Limited Verified independent store

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This no-clean solder paste flux is designed to make electronic soldering and repair work smoother and more reliable. Its strong solder-stickiness and clean performance help improve work efficiency, reduce rework effort, and support precise results in delicate PCB and BGA operations. Main Features Excellent solder-stickiness for stable and secure solder joints Excellent anti-wet capacity for controlled soldering No-clean and lead-free formula for environmental protection Suitable for multiple PCB reflow processes Widely used for BGA, PGA, CSP packages, and flip chip operations Useful for rework, sphere or pin attachment, and BGA rebelling tasks Specification Flux Type: NC-559-ASM / NC-559-ASM-UV (TPF) Volume: 10cc Particle Size: 1–10 μm Certification: CE Show more