Bambu PC — Tough, Heat-Ready, Engineering-Grade High heat resistance • Strong & durable • Functional parts Overview Bambu PC is designed for parts that must hold shape under heat and mechanical load. With excellent impact strength and a heat deflection temperature around 117 °C, it’s ideal for fixtures, housings, jigs, and other demanding functional parts. Why choose Bambu PC • Excellent thermal resistance for elevated-temperature use• Strong, rigid, and impact-resistant• Stable dimensions under load• Engineering-grade performance in a print-ready filament• AMS compatible with RFID auto-recognition Recommended print settings (starting points) • Drying: 80 °C × 8 h (keep < 20 % RH while printing)• Nozzle: 250–270 °C• Bed: 90–110 °C (use glue stick or PC adhesive)• Speed: < 300 mm/s• Printer: Enclosed recommended Build plates & adhesives • Best: Engineering Plate, High-Temp Plate, Textured PEI• Adhesive: PC-specific Magigoo• Not recommended: Cool Plate, Bambu Liquid Glue Notes & tips • Always dry thoroughly for strength, clarity, and adhesion• Transparent PC may affect LiDAR—disable if readings fluctuate• Store sealed with desiccant between prints What’s in the box • Bambu PC filament spool (1.75 mm ± 0.03 mm)• Desiccant Local advantages (Convoy-Westcan • Winnipeg) • Same-day or next-business-day dispatch when in stock• Free local courier on eligible filament orders over $50• In-store pickup available Policy snapshot Filament is final sale. Approved returns on other items must be brand new and unopened; restocking fees and non-refundable shipping may apply.