Features Precision Polishing Jig for accurate wafer/substrate polishing and back-thinning Thickness control screw fixture with a resolution of 0.005 mm to limit stock remove This Polishing fixture can be fit with Unipol 1202 and 1502 and any precision 12" or larger polishing machine with yoke support to achieve automatic polishing or lapping Super-hard tungsten alloy is welded on the bottom of the jig for polishing resistible Maximum sample thickness: 13mm Maximum travel distance: 14mm Sample Holder Vacuum chuck The maximum size of a wafer or substrate is 4" diameter If the thickness of the sample is greater than 0.15 mm, adopt vacuum absorption. If the thickness is less than 0.15 mm, please use wax Digital Micrometer One digital micrometer is included with a resolution of +/- 1 micron for more accurate lapping. Pressure Indicator One digital balance is included for measuring the fixture weight ( pressure ) Weight can be adjusted by screws while measuring on the digital balance from 1g to 2000g. Vacuum Absorption and Filter Require a vacuum pump with a rate > 70 L/ min. To protect the vacuum pump from any moisture and liquid, connect the filter between the fixture and the pump Application notes This fixture also can polish < 4" wafer via the blue tape method Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape Then put the 4" blue tape with the wafer to vacuum the chunk Size O.D: 146mm; Height: 266mm Application Notes Please click here to download how to use this fixture.This fixture also can polish < 4" wafer via the blue tape method Cut a 4 " diameter blue tape, then stick the 2- 3" wafer or < 4" irregular substrate on the tape Then put the 4" blue tape with the wafer to vacuum the chunk Optional Accessories A vacuum pump is required for vacuum absorption, please order it separately. FYP YTP550
