• 950 PLATINUM SOLDER SHEET •950 platinum solder sheet offers a flat, easy-to-cut format for precise soldering applications. Formulated specifically for bonding 950 platinum, this sheet solder is available in easy, medium, hard and extra hard grades—making it a versatile staple for clean, seamless jewellery soldering, fabrication, and repair. • KEY POINTS •[Solid 950 platinum-compatible solder][Clean flow][Lead & cadmium free][Ethically sourced & lab certified][Size: Approx. 1cm x 1cm per gram] • MORE INFO •Sheet solder allows for maximum control and customisation of solder piece sizes. Ideal for precision joins in bezels, jump rings, gallery wire, or layered assemblies. It can be cut into small chips (pallions) or strips as needed, offering smooth flow and strong bonds across a range of temperatures. • MELT TEMPERATURES •- Easy: 1110c / 2030f- Medium: 1240c / 2264f- Hard: 1400c / 2552f- Enamelling: 1550c / 2822f • USAGE & APPLICATIONS •Ideal for fine jewellery joins, multi-stage soldering, fabrication of bezels, backs, ring shanks, and layering sheet components. Sheet form offers excellent flexibility—use scissors or shears to cut custom-sized chips for precise placement and minimal clean-up. Compatible with standard flux and torch setups. • FLOW TEMPERATURES •Flow temperature refers to the specific temperature at which a solder alloy becomes molten and can flow to form joints. When soldering multiple components in close proximity, using solders with different flow temperatures is essential to maintain control and precision. Solders are typically categorized by their flow temperature: Hard solder has the highest melting point, while Easy solder melts at a lower temperature. This hierarchy allows for a sequential soldering process—beginning with high-temperature solder for the main structural components. Subsequent steps use solders with progressively lower flow temperatures (e.g., Easy), enabling additional components to be joined without disturbing or re-melting previously completed joints. This technique is particularly useful in complex assemblies where multiple soldering stages are required.
