8618 siliconefree thermal grease is a heat sink paste with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump out common with other pastes. 8618 has a wide operating temperature range making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied circuits can be powered up immediately offering exceptional convenience. This thermal paste is most often used as a gap filler on heatsinks to CPUs LEDs and other electronic components. Its high thermal conductivity makes it ideal for energyintensive devices like thermal sensors IGBTs thermal wells and power resistors. The paste’s soft consistency allows easy compression to achieve thin bond lines minimizing thermal resistance. For applications demanding lower thermal conductivity we have the 8617A 8616 and 860. We also have a full line of thermally conductive adhesives which provide a permanent bond and thermal gels which offer tack adhesion where a low modulus material is needed. Thermal conductivity of 6 W/(m·K) 1component compound Siliconefree will not contaminate surfaces Wide operating temperature ideal for aggressive thermal cycling conditions Low bond line thickness
