Rockchip's dual-chip solution integrates task scheduling and data preprocessing functions, and is equipped with a dedicated 20 TOPS NPU for AI inference. Its 3D RAM stacking architecture provides high bandwidth, enabling smooth local operation of 3B/7B parameter models with millisecond-level response times. Product Datasheet: Click Here Product Wiki: Click Here 3D RAM Stacking Architecture The RK182X coprocessor is designed for high-performance AI inference at the edge. Its 3D RAM stacking architecture provides ultra-high DRAM bandwidth, eliminating data bottlenecks and enabling smooth operation of 3B/7B parameter LLM and VLM while significantly reducing latency. It supports multiprecision computation for INT4/INT8/INT16 and mainstream frameworks such as TensorFlow and PyTorch, meeting diverse edge AI development needs. Feature Dual-Core Design for Multi-Task Processing: The Rockchip RK3588+RK182X architecture enables efficient collaboration through PCIe interconnection. Main Module Supports 8K Codec: The main module utilizes an RK3588 octa-core CPU and its high-performance VPU, providing 8K video codecs and multi-channel 4K streaming capabilities. Combined with the AI computing power of the RK182X coprocessor, it can provide real-time video analytics for edge vision applications. High-Bandwidth DRAM: It integrates high-bandwidth embedded DRAM (2.5GB/5GB versions), with a token generation rate exceeding 100 tokens/second and end-to-end latency as low as 0.1 seconds. Millisecond-Level Low Latency: The dedicated RK182X NPU, coordinated by the RK3588, enables real-time decision-making even in poor network conditions, thereby improving the reliability and security of critical applications such as medical monitoring and autonomous driving. Product Overview
