Overview Soder-Wick ® offers the state of the art in desoldering technology. Soder-Wick ® is designed for today's heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick ® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen. Features Soder-Wick ® Rosin 5' and 10' spools packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Noncorrosive ultra high purity Type R rosin flux Minimizes the risk of heat damage to the board Will not leave ionic contamination on the boards Applications Soder-Wick ® Rosin safely removes solder in all applications requiring Type ROL0 rosin flux BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes Specifications MIL-F-14256 F type R flux NASA-STD-8739.3 Soldered Electrical Connections DOD-STD-883E, Method 2022 ANSI/IPC J STD-004, Type ROL0 #2 yellow, 0.050"/ 1.3mm width, 100' / 30.5 m length on spool
