Overview Soder-Wick ® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick ® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick ® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen. Features Soder-Wick ® No Clean packaged in ESD-safe static dissipative bobbins Minimizes the risk of damage associated with static electricity Patented noncorrosive, halide free, organic no-clean flux Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance Applications Soder-Wick ® No Clean SD safely removes solder in all applications requiring Type ROL0 flux BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes Specifications MIL-F-14256 F NASA-STD-8739.3 Soldered Electrical Connections DOD-STD-883E, Method 2022 ANSI/IPC J STD-004, Type ROL0 Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818 Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderabilit #2 yellow, 0.05"/ 1.3mm width, 10' / 3.0 m length on SD bobbin
