138° Solder Paste Syringe Flux for SMD, BGA, IC, PCB – Needle Tube Tin Solder Paste

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138° Solder Paste Syringe Flux for Soldering SMD BGA IC PCB Needle Tube Tin Solder Paste, Lead-free low temperature solder paste, Pusher/needle feed The 138° Lead-Free Low-Temperat ure Solder Paste Syringe Flux is specifically designed for soldering SMD (Surface Mount Devices), BGA (Ball Grid Array), IC (Integrated Circuit), and PCB (Printed Circuit Board). It features an environmentally friendly, lead-free formulation with a low melting point of 138°C, making it suitable for soldering temperature-sensitive components. The solder paste is packaged in a syringe with a needle for precise application, ensuring clean and reliable solder joints. Applications: Soldering of surface-mount devices (SMD) Repair and reflow soldering of BGA chips Soldering of ICs and PCB connections Low-temperature soldering, ideal for temperature-sensitive components Suitable for precise soldering in electronics manufacturing or repair tasks Show more