Thermal Grizzly Putty - Basic, Advance, Pro Key Features Soft and moldable for maximum surface contact Non-electrically conductive Easy to cut and apply Suitable for gaps of 0.2–3 mm Available in multiple thermal performance levels to match your needs The Thermal Grizzly Putty series is a high-performance gap filler designed to replace traditional thermal pads. Its soft, moldable consistency ensures optimal contact between components and heatsinks, providing efficient heat transfer. Basic: Medium thermal conductivity, ideal for standard cooling requirements. Advance: Higher thermal conductivity for better heat management in hotter systems. Pro: Ultra-high thermal conductivity, perfect for extreme cooling and overclocking setups. Specifications Brand: Thermal Grizzly Product Name: TG Putty Type: Gap filler / Thermal Putty Material: Silicone-based, clay-like consistency Electrical Conductivity: Non-conductive Installation: Easy to cut and apply Gap Compatibility: 0.2 mm – 3 mm Thermal Conductivity & Use Cases by Variant: Basic: Medium – general GPU/VRAM/VRM use Advance: Good – better cooling for hotter systems Pro: Excellent – high-end or overclocked systems
