Ultra-Flat SiNx Coated Substrates

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Ultra-Flat SiNx Coated Wafer 5 x 5mm Diced Ultra-Flat SiNx on Silicon Substrates The Ultra-Flat SiNx Substrates consist of ultra-flat silicon wafers coated with 200nm of amorphous nonstoichiometric ultra low-stress silicon nitride, similar to our silicon nitride grids. The ultra-flat SiNx substrates are available in 6" wafer and conveniently diced 5 x 5mm, 5 x 7mm and 10 x 10mm chips. The 6" wafer is shipped in a 6" wafer carrier; the diced pieces are shipped in a Gel-Pak® Box. The wafers are stealth diced, a special clean dicing process which produces debris-free substrates. All products are packed in class 10 clean room conditions. Properties for thermal SiNx substrates: Material: CZ Virgin Silicon Wafer Grade: Prime Diameter: 150mm Orientation: Type/Dopant: P/Boron Resistivity: 10-20 Ohm-cm Thickness: 675 +/- 25µm TTV: ≤2µm Site Flatness: ≤1µm Warp: ≤30µm Bow: ≤20µm Front Surface: Polished Back Surface: Etched Flat: 1 per SEMI Standard 2000A +/- 100A SiNx Show more