15" fully automated precision polishing machine for three 4" wafers with Bluetooth-enabled thickness control, two slurry feeder/mixing and Touch-Screen Control - Unipol-1503
The UNIPOL-1503 is a desktop-type automatic precision grinding and polishing machine. It is equipped with a Ø381 mm grinding/polishing plate, two slurry/dripping systems, and three working stations. Each working station can process workpieces up to Ø100 mm (4 inches) in diameter. One of the three working stations features Bluetooth-enabled thickness control, which monitors the lapping/polishing thickness and automatically stops the process when the target value is reached. This machine is suitable for processing crystals, ceramics, metals, glass, rock samples, mineral samples, PCB boards, infrared optical materials, refractory materials, composite materials, and other similar materials. SPECIFICATIONS Voltage AC208-240V (50/60Hz) 10A (110V available upon request) Control Mode PLC control+ 10" touch screen control Two Flat Lapping Plates Two flat lapping plates are included with Flatness< 0.25 micron/Inch² Major lapping plate diameter: 15" One is made of cast iron with growing for lapping One is made of Aluminum for holding polishing pads Spin speed: 0 to 120 RPM with digital display Sample Size & Workstation Three workstations with a 4" sample per run One Bluetooth-enabled thickness control Swing Arm Swing frequency: 10/min max Optional Accessories Consumables for polishing/lapping/grinding. Click Pic. 1 to see more details The multi-sample polishing fixture is available up to 3 x 8 pcs for 1" dia. samples per batch (Pic. 2) Precision Thickness Checker with 0.001 mm Dial/Digital Indicator available at an extra cost (Click Pic. 3) pic 1 pic 2 pic 3 Compliance CE Certified NRTL certification is available at an extra cost Shipping Dimensions 1030 x 790 x 1050, mm (L x W x H) Application Notes If the sample is small compared to the sample loading plate, please do the lapping/polishing with at least 3 similar samples, and mount the samples in a symmetrical, balanced pattern. This is crucial for the normal operation of the machine Clean the machine including the polishing plate and the sample loading plate after each use. The machine must be disconnected from the power supply before cleaning! DO NOT use cleaning agents or oil-based liquid! ONLY use water to wipe clean the machine. DO NOT flush the polishing plate sink! Limit the water level in the sink to no higher than 5 mm. Otherwise, the machine circuitry could be damaged by the overflowing water The motor control circuit could be damaged by surge current. DO NOT start the rotary plates from a high rpm! Gradually increase the rotary speed to the desired value. Wait at least 10 sec between switching motor ON/OFF!
Related
Related
Related
Related