The UNIPOL-1210M Fully Automatic Metallographic Grinding and Polishing System is a comprehensive solution integrating automatic embedding, grinding, polishing, and cleaning units. It enables a seamless automated workflow from embedding to sample preparation and final cleaning within 40 - 60 minutes, ensuring consistency and efficiency. The system is suitable for a wide range of materials such as metals, ceramics, and rock samples. Specifications Embedding Unit Embedding Capacity: Up to 6 samples per cycle Embedding Diameter: ≤25mm) Drive Mechanism: Hydraulic Heating Temperature: Up to 180°C Heating Power: 1200W Compression Force per Station: 220kg Grinding and Polishing Unit Vacuum Suction Mechanism Plate Size: φ300mm Plate Speed: 50-500rpm Sample Holder Diameter: φ30mm x 6 Sample Holder Speed: 10-60rpm Pressure Control: Multi-Point Adjustable Maximum Single Sample Loading Force: 1-5kg Consumable Storage Unit Automatically Replaces Grinding Papers and Polishing Pads Stores up to 16 Sets of Consumables, with Customizable Replacement Sequences Vacuum Suction for Securing Consumables Programmable Grinding/Polishing Duration and Frequency Cleaning Unit Equipped with Water Inlet and Drainage Systems Ultrasonic Cleaning Fluid Supply Water, Grinding Paste × 1 Suspension × 4 Additional Features Automatic Transfer of Samples to Grinding/Polishing Plates After Embedding Automated Switching Between Coarse and Fine Abrasive Papers During Grinding Automatic Adjustment of Polishing Pads for Different Materials Automatic Dispensing of Water or Polishing Liquids as Required Automated Sample Transfer to the Cleaning Unit Real-Time Process Monitoring All Parameters Can Be Configured and Stored for One-Touch Operation Reference Video Click Here to Play Operation procedure Make samples ( 6 pcs) with a flat to be polished and ready Put 6 samples into position to be embedded on the machine Set the program of polishing in touch screen, usually two rough lapping and two polishing Touch the " run" button on the control panel, then the machine will finish embedding, lapping, and polishing in 40 - 60 minutes, depending on sample size and final polishing roughness Note: integrating with a robot, we can realize the autonomous operation from sample mounting, etching, and microscope observation.