Incure Uni-Seal™ 3718F Flexible Encapsulant for Electronics with Secondary Heat Cure

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Incure Uni-Seal™ 3718F is a flexible encapsulant designed for electronic devices. It cures in seconds with a secondary heat cure option for hidden areas, ensuring a complete and re liable bond. This highly viscous, slightly translucent material bonds to many different substrates, providing a protective and flexible layer for various electronic applications.Key Features: Substrates: Multi-Substrates Color: Slightly Translucent Viscosity: 14,000 cP Tensile (psi): 2,400-5,200 Hardness: D40-D50 Elongation: 254% Highlights: Flexible encapsulant, cures in seconds, secondary heat cure option for hidden areas, bonds to many different substrates Show more