DC/RF 4-Head 2" High Vacuum Magnetron Plasma Sputtering Coater System -VTC600GD4HD

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The VTC-600GD-4HD High Vacuum Magnetron Sputtering System coating device designed for the deposition of single-layer films. It can be configured with up to four sputtering targets, and also can be equipped with an RF power supply for sputtering non-conductive target materials, or a DC power supply for sputtering conductive materials. It offers broader application capabilities, small footprint as well as a compact and user-friendly design, making it an ideal tool for laboratory thin film deposition. It is especially suitable for research on solid-state electrolytes, OLEDs, and other advanced materials. 3 RF heads model is available. Highlights: Modular System Design: The system adopts a modular structure with separate vacuum chamber, pumping unit, and control power supplies, allowing flexible configuration based on user requirements. Flexible Power Configuration: Users can choose from various power supply setups—one power supply can control multiple sputtering targets, or each target can be independently controlled by a dedicated power supply. SPECIFICATIONS Power Requirements 208–240 VAC, Single Phase, 50/60 Hz Total Power Consumption < 3.5 kW Source Power DC Source: 500W power for coating metallic materials RF Source: 300W power, 13.56 MHz frequency for coating non-conductive materials Magnetron Sputtering Head Four 2" Magnetron Sputtering Heads with water cooling jackets and shutters One is connected to a DC source for metallic materials The other is connected to the RF source for non-conductive materials Target size: 2" diameter with a thickness of 0.1 - 5 mm Sputtering targets are optional Recommended Sputtering Recipe and Useful Tips Extra 148 cm RF cable can be ordered at extra cost for the replacement Vacuum Chamber Stainless Steel Semicircular Vacuum Chamber: Ø300 Hinged type top flange for easy sample access Here is a glance of the vacuum chamber Ultimate Vacuum: 3.0 × 10⁻⁵ Pa (2.25 × 10⁻⁷ Torr) Sample Stage Ø140 mm rotating and heating sample stage up to 500°C Rotation speed: 1 - 20 rpm Gas Flow Control Two mass flow controllers (MFC) Flow rate: 0 – 200 sccm nitrogen calibrated 1/4" vent port. Vacuum Pump Station (Optional) For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure Show more