The Inspectis Microscope BGA Inspection System Basics (BGA-Basics) is a professional-grade side-view optical inspection platform engineered for reliable analysis of hidden solder joints on BGA, µBGA, CSP, CGA, FipChip, and top-view SMD components. At its core is a 5.0 MP USB3.0 digital camera paired with precision optics and integrated LED illumination, delivering crisp imaging of features down to ~40 µm stand-off for detailed defect evaluation and quality control workflows. Powered by INSPECTIS® BGA Basics software, this system provides intuitive tools for live imaging, image capture, distance measurement, advanced camera control, and organized documentation — making it ideal for manufacturing QA, electronics inspection, and laboratory analysis. Specifications Part Number / SKU: BGA-Basics Side-View BGA Lens:• On-screen Magnification: ~25×–200× (24″ monitor) • Working Distance: ~0.5–25 mm focusing range • Illumination: High-power pure white LED through microprisms • Probe Footprint: ~0.85 × 6.6 mm on PCB (~1 mm free area required) Integrated Digital Camera:• Sensor: 1/2.5″ CMOS, 5 MP (2592 × 1944)• Pixel Size: 2.2 µm × 2.2 µm • Interface: USB3.0/USB3.1 Gen 1 (backwards compatible with USB2.0) • Video Formats: 5 MP @ 15 fps, 3 MP @ 24 fps, Full HD 1080p @ 30 fps • Controls: Auto/manual exposure, white balance, contrast, brightness, gamma, sharpness, HDR, flip H/V• Preset/Recall: Factory and user-definable magnification and calibration memories • Image Capture: Snap via device switch, optional foot pedal, or software • Mount: UNC 1/4″-20 Illumination: Incident LED light + LED gooseneck brush light with electronic intensity control Stand: Large antistatic coated base with coarse/fine focus, ±90° pivot, soft-touch probe protection, includes 4 magnetic pegs Environmental Protection: ESD protected with GND points on stand & optional XY stage System Size / Weight: ~400 × 295 × 385 mm / ~9.2 kg Operating Conditions: −20 °C to +60 °C; 20–95 % RH, non-condensing Included: Computer and 27″ UHD/4K monitor (3840 × 2160) + aluminum carrying case Manufactured: Sweden Return Policy: Non-returnable Features & Benefits Side-View Optical BGA Inspection: Designed to reveal hidden solder joints on BGAs and fine-pitch components for effective quality analysis. High-Resolution Imaging: 5 MP digital camera and precise optics deliver detailed visuals for inspection and documentation. Advanced Camera Controls: Full manual and automatic settings — including HDR, frame stacking, and white balance — support tailored imaging workflows. User-Friendly Software: Inspectis BGA Basics software provides tools for image capture, measurement, comparison, and documentation — simplifying inspection workflows. Durable Industrial Build: Antistatic stand and ESD-protected design ensure reliable performance in manufacturing and lab environments. Complete Turnkey System: Includes high-resolution monitor, computing, and protective storage for a ready-to-use inspection station.
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