The Inspectis Microscope Light BGA Inspection System is a reliable hand‑operated optical inspection platform designed for side‑view analysis of BGA, µBGA, CSP, CGA, FipChip, and SMD components on printed circuit boards. Featuring a 5.0 MP USB 3.0 digital camera and versatile optics, this system delivers clear imaging of hidden solder joints down to approximately 40 µm stand‑off — ideal for electronics manufacturing, quality control, and assembly analysis. Equipped with Inspectis BGA Basics software, the system offers tools for live image viewing, image capture, distance measurement, advanced camera control, utilities, and documentation. The robust bench‑top microscope holder includes ESD protection and ground connection points, while the included computer with 27″ UHD/4K monitor and aluminum carrying case make this a complete turnkey inspection solution. Specifications Part Number / SKU: BGA‑Light Optical Probe: 90° side‑view BGA lens Magnification: ~ 25× – 200× on 24″ monitor (on‑screen) Working Distance: ~ 0.5 – 25 mm focusing range Illumination: High‑power pure white LED light via microprisms Probe Footprint: ~ 0.85 × 6.6 mm on PCB (≈ 1 mm free area required) Integrated Digital Camera: 1/2.5″ CMOS, 5 MP (2592 × 1944) Video Formats: 2592×1944 @15 fps; 2000×1500 @24 fps; 1920×1080 @30 fps Controls: Auto/manual white balance, exposure, contrast, brightness, gamma, sharpness, HDR, axis flip Memory Presets: Factory and user‑definable calibrated magnifications with quick access buttons Image Capture: Snap via device switch, foot pedal, or software Software: Inspectis BGA Basics — image capture, measurement, analysis, utilities, and documentation tools Mounting: Standard UNC 1/4″‑20 thread Stand: Inspectis bench‑top microscope holder with ESD protection and ground connection Operating Environment: −20 °C to +60 °C; 20‑95 % RH, non‑condensing Display & Computer: Includes computer with 27″ UHD/4K monitor (3840 × 2160) Case: Aluminum carrying case included Manufactured in: Sweden Return Policy: This item is non‑returnable. Features & Benefits High‑Resolution Inspection: The 5 MP USB3.0 digital camera captures detailed images of hidden solder joints and PCB features down to ~40 µm stand‑off. Side‑View BGA Optics: Optimized 90° side‑view BGA lens enables inspection of concealed solder connections on BGAs and similar components. Advanced Inspection Software: Inspectis BGA Basics software provides live view, image capture, distance measurement, and documentation tools for thorough inspection analysis. ESD‑Protected Stand: The included bench‑top holder features ESD protection and grounding points for safe electronics inspection. Ready‑to‑Use System: Includes a computer, 27″ UHD/4K monitor, and aluminum carrying case — everything needed for inspection workflows. Flexible Control: Camera settings like white balance, exposure, and image adjustments can be controlled manually or automatically.
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