Does your prototyping project require soldering? Are you looking for something other than your usual run-o'-the-mill solder wire? Look no further! This high quality, low cost, adorably packaged Lead-Free Prototyping Solder Paste from IC Breakout will provide strong, flux-aided conductive bonds for your board. This paste is now reformulated to melt at very low temperatures - only 140 °C! Since it’s premixed, all you need to do is screw on the self-piercing cap, squeeze the paste onto your solder pads, and heat it up using a soldering iron, oven, or any other thermal source to reach the reflow temperature of 140 °C (284 °F). Once liquidus, remove your heat source and let it cool. The lead free metal content is a mix of Bismuth, Tin and Silver. The mix is a eutectic solder, meaning that it’s either going to be a solid or liquid during re-flow; not something in between. Features: Lead free No clean-up Clear residue Premixed, ready to use Low temperature use Specifications: Bi57 42Sn Ag1 ~10 grams Liquidus at 140 °C (284 °F)
