VTC-600-3HD-LD is a combinatorial plasma sputtering system with three 2“ magnetron sputtering sources and three RF/DC power supplies. Such a sputtering system is capable of co-sputtering up to three different target materials and creates various composition profiles across the substrate (e.g. ternary materials for Li-ion rechargeable battery). This system is also suitable for sequential coating of multiple layer films such as ferroelectric, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE, etc. SPECIFICATIONS Power 208-240 VAC, single phase, 50/60 Hz, 1500 W Sputtering Power Sources Three sputtering power sources Two DC source: 500 W power for coating metallic materials One RF source: 300 W power, 13.56 MHz frequency for coating non-conductive materials Other combinations are available upon request. Magnetron Sputtering Head Three 2" Magnetron Sputtering Heads with water cooling jackets and shutters Two are connected to DC sources for metallic materials One is connected to the RF source for non-conductive materials Target size: 2" diameter with a thickness of 0.1 - 5 mm Sputtering targets are optional Recommended Sputtering Recipe and Useful Tips 2 RF heads model is available Extra 148 cm RF cable can be ordered at extra cost for the replacement Four heads sputtering system is available upon request Vacuum Chamber Stainless steel vacuum chamber: Ø300 × 300 mm H One 100 mm glass view port. Hinged type top flange for easy sample access Here is a glance of the vacuum chamber Sample Stage Ø140 mm rotating and heating sample stage up to 500°C Rotation speed: 1 - 20 rpm Single-point programmable temperature controller Gas Flow Control Three mass flow controllers (MFC) Flow rate: 0 – 200 sccm nitrogen calibrated 1/4" vent port. Vacuum Pump Station (Optional) For air-sensitive targets, such as Al, Ti, Cr, etc, or base pressure