Waveshare Luckfox Core1106 Core Board with Wi-Fi Based on Rockchip RV1106

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DescriptionThe Waveshare Luckfox Core1106 Core Board with Wi-Fi is a compact Rockchip RV1106 core board for AI vision, embedded Linux, product prototyping and custom carrier-board development. It integrates the RV1106 processor platform with ARM Cortex-A7 CPU resources, RISC-V MCU resources, NPU acceleration, ISP image processing, onboard storage options and castellated-hole I/O.This Luckfox Core1106 Wi-Fi board is designed for developers who need a small module that can be directly integrated into products or used for quick hardware verification. The board exposes interfaces such as MIPI CSI, RGB LCD, GPIO, UART, SPI, I2C, USB, Ethernet and SDIO through castellated holes.The Wi-Fi variants include 2.4GHz Wi-Fi 6 and Bluetooth 5.2/BLE. Choose between 128MB or 256MB memory and 256MB SPI NAND or 8GB eMMC storage to match the required boot medium, cost target and software image size.Features Core board based on Rockchip RV1106 for AI vision and embedded product development. Single-core ARM Cortex-A7 32-bit processor with integrated NEON and FPU. Built-in Rockchip fourth-generation NPU: RV1106G2 provides 0.5TOPS, RV1106G3 provides 1TOPS. Integrated third-generation ISP3.2, supporting 5MP input at 30fps. Hardware video encoding supports MJPEG, H.264 and H.265. Wireless variants include 2.4GHz Wi-Fi 6 and Bluetooth 5.2/BLE. Castellated holes expose MIPI CSI, RGB LCD, GPIO, UART, SPI, I2C, USB, Ethernet, SDIO and more. Available in 128MB or 256MB memory and 256MB SPI NAND or 8GB eMMC storage versions. Specifications Product name Waveshare Luckfox Core1106 Core Board with Wi-Fi Based on Rockchip RV1106 Product type Rockchip RV1106 AI vision core board with Wi-Fi Processor Cortex-A7 @ 1.2GHz NPU RV1106G2: 0.5TOPS; RV1106G3: 1TOPS; supports int4, int8 and int16 ISP Supports 5MP input at 30fps Video encoding Hardware encoding, MJPEG / H.264 / H.265 Memory options 128MB DDR3L or 256MB DDR3L Storage options 256MB SPI NAND or 8GB eMMC 5.1 Wireless 2.4GHz Wi-Fi 6 and Bluetooth 5.2/BLE Display interface Parallel RGB 18-bit x 1 Camera interface MIPI CSI 2-lane x 2 or MIPI CSI 4-lane x 1 Audio Analog differential MIC interface x 2, LINEOUT x 1 USB USB 2.0 Host/Device Ethernet 10/100M Ethernet controller and embedded PHY Other resources I2S x 3, I2C x 5, SPI x 2, SDIO x 2, ADC x 2, UART x 6, PWM x 12 Dimensions 30 x 30 mm Castellated holes 112 pin Package weight 0.014 kg Applications AI camera terminals and compact vision-recognition devices. Smart monitoring, industrial inspection and video capture products. Robotics perception modules and edge AI prototypes. Custom carrier-board development with MIPI CSI, Ethernet, USB and GPIO resources. Low-power embedded Linux devices that need Wi-Fi and Bluetooth connectivity. Product List Core110612N256 128MB memory, Wi-Fi, 256MB SPI NAND variant x 1 Core11061208 128MB memory, Wi-Fi, 8GB eMMC variant x 1 Core110614N256 256MB memory, Wi-Fi, 256MB SPI NAND variant x 1 Core11061408 256MB memory, Wi-Fi, 8GB eMMC variant x 1 Included item One selected Core1106 Wi-Fi core board according to the ordered variant Not included Carrier board, camera, display, antenna cable, power supply and other demo accessories unless separately stated Other ContentVariant guidance: choose 8GB eMMC when the application image needs more onboard storage. Choose 256MB SPI NAND for compact firmware builds where lower storage capacity is sufficient. The 256MB memory variants use the RV1106G3 platform and provide higher NPU performance than the 128MB memory variants.Integration note: check the official pinout, carrier-board power design, boot medium and interface multiplexing before layout. The castellated-hole design is useful for compact product integration, but it requires careful soldering and a validated test fixture.Development workflow: use the official documentation to prepare images, configure peripherals and confirm wireless functions. Keep a known-good board and image for comparison when debugging boot, display, camera or network issues.Core1106 overview: The official overview shows the Luckfox Core1106 compact core-board layout, wireless option and castellated-hole integration concept.Feature layout: This diagram highlights the RV1106 processor platform, onboard storage options and expansion resources available for embedded designs.Version options: The version image helps compare memory, wireless and storage selections before choosing a Core1106 Wi-Fi variant.RV1106 processor: The Rockchip RV1106 combines CPU, NPU and ISP resources for compact AI vision and video applications.Wi-Fi 6 and Bluetooth module: The wireless version integrates 2.4GHz Wi-Fi 6 and Bluetooth 5.2/BLE for local networking and device communication.On-board components: The component map helps engineers identify the processor, PMIC, storage area, wireless module and antenna connector.Ordering codes: The ordering-code chart is useful for confirming memory, wireless and storage combinations by model number.Outline dimensions: The 30 x 30 mm dimension drawing helps with carrier-board, enclosure and clearance planning.128MB NAND wireless package: Core110612N256 is the 128MB memory, Wi-Fi, 256MB SPI NAND variant.256MB NAND wireless package: Core110614N256 is the 256MB memory, Wi-Fi, 256MB SPI NAND variant.Carrier-board planning: Before drawing a custom base board, reserve space for programming access, reset control, boot selection, debug serial output, antenna placement and thermal clearance. Map each required peripheral first, then decide which pins should remain testable after the module is soldered down. For production fixtures, add clear reference marks and stable mechanical stops so repeated placement does not damage pads or side contacts. If the design uses cameras, displays or network ports, verify connector orientation with a bench sample before releasing the board outline.Power and signal review: Keep input rails within the limits defined by the hardware guide and check power-up order with the selected peripherals attached. High-speed traces, clock lines and analog audio paths should be routed with short return paths and enough spacing from noisy loads. If the unit will be installed in a sealed enclosure, test warm-start behavior after a long run, because heat and cable strain can expose problems that do not appear during a quick desktop boot.Software bring-up: Prepare one clean reference image and document the exact flashing, login and peripheral-test commands used by the team. After first boot, confirm storage detection, network connection, serial output, display timing and camera capture in small steps. Keep logs from the first successful run so later batches can be compared quickly. For classroom, lab or small-batch deployment, label each sample by storage type and memory size to avoid mixing firmware images during debugging.Procurement and quality check: For projects with several revisions, record the ordered model, storage type, memory size, purchase batch and test image in the project log. Inspect solder joints, side pads and connector areas before assembly, then run a short acceptance test that covers boot, network setup, peripheral detection and a sample capture. Keep packaging labels until the build is approved, because they are useful when comparing early samples with later production batches. When a design moves from prototype to small production, freeze the firmware package, test procedure and mechanical drawing together so each team member can reproduce the same setup.Deployment advice: Leave enough room around the module for rework tools and inspection under magnification. If the module is mounted near motors, relays, bright lights or metal parts, evaluate interference and heat in the real enclosure rather than only on an open bench. For field units, include a simple recovery process and a documented way to identify the installed variant without opening the case. These small checks reduce avoidable service work after installation.Receiving checklist: On arrival, compare the label with the purchase order, take a photo for the project record and store each sample in an antistatic bag. Before handing parts to another engineer, note which board has already been flashed, which one is still untouched and which accessories were used during testing. Clear sample control prevents accidental reuse of a modified unit when a clean baseline is needed for troubleshooting.Handling note: Avoid touching exposed pads directly. Use fine tweezers or a vacuum pickup during assembly, keep liquids and loose metal parts away from the bench, and place the unit on a flat nonconductive surface during early testing. If a project is paused, return the sample to labeled storage with its cable set and notes so the next test session can restart without guessing.Documentation tip: Keep a simple project note with the date, operator, cable set, host equipment, measured current and any unusual behavior seen during trial runs. This habit is especially useful when several people share the same bench or when a prototype returns after weeks of storage. Good notes shorten support conversations and make it easier to decide whether an issue is related to assembly, firmware, power, cabling or the surrounding fixture.Resources Luckfox Core1106 Wiki Core1106 resources download FAQWhat is the difference between the Core1106 Wi-Fi variants?The variants differ by memory size and storage type: 128MB or 256MB memory, plus 256MB SPI NAND or 8GB eMMC storage.Does the board include wireless connectivity?Yes. This product group is for the Wi-Fi variants with 2.4GHz Wi-Fi 6 and Bluetooth 5.2/BLE.Which version has stronger NPU performance?The 256MB memory variants use RV1106G3 with 1TOPS NPU performance, while the 128MB memory variants use RV1106G2 with 0.5TOPS.Is a carrier board included?No. The package includes the selected Core1106 Wi-Fi core board only.Where can I find software and hardware resources?Use the official Luckfox Core1106 Wiki and resources download page linked in the Resources section. Show more